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an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. tps79901-ep sbvs330a ? september 2017 ? revised october 2017 tps79901-ep 200-ma, low-quiescent current, ultra-low-noise, high-psrr low-dropout linear regulator 1 1 features 1 ? 200-ma low-dropout regulator with en ? multiple output voltage versions available: ? adjustable outputs from 1.2 v to 6.5 v ? inrush current protection with en toggle ? low i q : 40 a ? high psrr: ? 66 db at 1 khz ? 51 db at 10 khz ? stable with a low-esr, 2- f typical output capacitance ? excellent load and line transient response ? 2% overall accuracy (load, line, and temperature) ? very low dropout: 100 mv ? package: 6-pin son ? supports defense, aerospace, and medical applications ? controlled baseline ? one assembly and test site ? one fabrication site ? available in military ( ? 55 c to 125 c) temperature range ? extended product life cycle ? extended product-change notification ? product traceability 2 applications ? base stations ? smart phones ? epos ? wearable electronics ? vcos, rf ? wireless lan, bluetooth ? 3 description the tps79901 family of low-dropout (ldo), low- power linear regulators offers excellent ac performance with very low ground current. high power-supply rejection ratio (psrr), low noise, fast start-up, and excellent line and load transient response are provided while consuming a very low 40- a (typical) ground current. the tps79901 is stable with ceramic capacitors and uses an advanced bicmos fabrication process to yield a dropout voltage of typically 100 mv at a 200-ma output. the tps79901 uses a precision voltage reference and feedback loop to achieve an overall accuracy of 2% over all load, line, process, and temperature variations. the tps79901 features inrush current protection when the en toggle is used to start the device, immediately clamping the current. the tps79901 is fully specified over the temperature range of t j = ? 55 c to +125 c, and offered in a low- profile, ideal for wireless handsets and wlan cards. device information (1) part number package body size (nom) tps79901-ep son (6) 2.00 mm 2.00 mm (1) for all available packages, see the package option addendum at the end of the data sheet. typical application circuit productfolder tps79901 gnd en fb in out v in v out r 1 c fb r 2 optional input capacitor. may improve source impedance, noise, or psrr. v = out 1.193 (r + r ) 1 2 r 2 v en 2.2 f m ceramic copyright ? 2017, texas instruments incorporated support &community tools & software technical documents ordernow
2 tps79901-ep sbvs330a ? september 2017 ? revised october 2017 www.ti.com product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 pin configuration and functions ......................... 3 6 specifications ......................................................... 4 6.1 absolute maximum ratings ...................................... 4 6.2 esd ratings .............................................................. 4 6.3 recommended operating conditions ....................... 4 6.4 thermal information .................................................. 4 6.5 electrical characteristics ........................................... 5 6.6 typical characteristics .............................................. 7 7 detailed description ............................................ 12 7.1 overview ................................................................. 12 7.2 functional block diagram ....................................... 12 7.3 feature description ................................................. 12 7.4 device functional modes ........................................ 13 8 application and implementation ........................ 14 8.1 application information ............................................ 14 8.2 typical applications ................................................ 14 8.3 do ' s and don ' ts ....................................................... 16 9 power supply recommendations ...................... 16 10 layout ................................................................... 16 10.1 layout guidelines ................................................. 16 10.2 layout example .................................................... 17 11 device and documentation support ................. 18 11.1 device support ...................................................... 18 11.2 documentation support ........................................ 18 11.3 receiving notification of documentation updates 18 11.4 community resources .......................................... 18 11.5 trademarks ........................................................... 19 11.6 electrostatic discharge caution ............................ 19 11.7 glossary ................................................................ 19 12 mechanical, packaging, and orderable information ........................................................... 20 4 revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from original (september 2017) to revision a page ? changed content in features section ..................................................................................................................................... 1 ? changed content in description section ................................................................................................................................. 1 ? deleted nr from the pin functions table ............................................................................................................................... 3 ? changed hbm value from 2000 : to 1500 in the esd ratings section .............................................................................. 4 ? deleted errant part numbers from the electrical characteristics section ............................................................................... 5 ? deleted errant part numbers from the typical characteristics section .................................................................................. 7
3 tps79901-ep www.ti.com sbvs330a ? september 2017 ? revised october 2017 product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated 5 pin configuration and functions drv package 6-pin son with exposed thermal pad top view pin functions pin i/o description name no. in 6 i input supply. gnd 3, pad ? ground. the pad must be tied to gnd. en 4 i driving this pin high turns on the regulator. driving this pin low puts the regulator into shutdown mode. en can be connected to in if not used. fb 2 i adjustable voltage version only. feedback; this pin is the input to the control loop error amplifier and sets the output voltage of the device. out 1 o output of the regulator. to assure stability, a small ceramic capacitor (total typical capacitance 2 f) is required from this pin to ground. n/c 5 ? not internally connected. this pin must either be left open or tied to gnd. 6 5 4 1 2 3 gnd out fb in gnd en n/c
4 tps79901-ep sbvs330a ? september 2017 ? revised october 2017 www.ti.com product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions . exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltages are with respect to network ground terminal. 6 specifications 6.1 absolute maximum ratings over operating junction temperature range (unless otherwise noted) (1) min max unit voltage (2) in ? 0.3 7 v en ? 0.3 v in + 0.3 out ? 0.3 v in + 0.3 current out internally limited ma temperature operating virtual junction, t j ? 55 150 c storage temperature range, t stg ? 55 150 (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 6.2 esd ratings value unit v (esd) electrostatic discharge human-body model (hbm), per ansi/esda/jedec js-001, all pins (1) 1500 v charged-device model (cdm), per jedec specification jesd22-c101, all pins (2) 500 (1) minimum v in = v out + v do or 2.7 v, whichever is greater. 6.3 recommended operating conditions over operating junction temperature range (unless otherwise noted) min nom max unit v in input voltage (1) 2.7 6.5 v i out output current 0.5 200 ma t j operating junction temperature ? 55 125 c (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . 6.4 thermal information thermal metric (1) tps799 unit drv (son) 6 pins r ja junction-to-ambient thermal resistance 74.2 c/w r jc(top) junction-to-case (top) thermal resistance 58.8 c/w r jb junction-to-board thermal resistance 145.9 c/w jt junction-to-top characterization parameter 0.2 c/w jb junction-to-board characterization parameter 54.4 c/w r jc(bot) junction-to-case (bottom) thermal resistance 7.2 c/w
5 tps79901-ep www.ti.com sbvs330a ? september 2017 ? revised october 2017 product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated (1) minimum v in = v out + v do or 2.7 v, whichever is greater. (2) v do is not measured for v out(nom) < 2.8 v because minimum v in = 2.7 v. 6.5 electrical characteristics at t j = ? 55 c to +125 c, v in = v out(nom) + 0.3 v or 2.7 v, whichever is greater; i out = 1 ma, v en = v in , c out = 2.2 f, c nr = 0.01 f, and v out = 3 v (unless otherwise noted). typical values are at t j = 25 c. parameter test conditions min typ max unit v in input voltage range 2.7 6.5 v v fb internal reference 1.169 1.193 1.217 v v out output voltage range v fb 6.5 ? v do v output accuracy, nominal t j = 25 c ? 1% 1% output accuracy (1) over v in , i out , temperature v out + 0.3 v v in 6.5 v 500 a i out 200 ma ? 2% 1% 2% v o( vi) line regulation (1) v out(nom) + 0.3 v v in 6.5 v 0.02 %/v v o( io) load regulation 500 a i out 200 ma 0.002 %/ma v do dropout voltage (2) (v in = v out(nom) ? 0.1 v) i out = 200 ma v out(nom) 3.3 v 100 175 mv v out(nom) 3.3 v 90 160 i cl output current limit v out = 0.9 v out(nom) 220 400 600 ma i gnd ground pin current 500 a i out 200 ma 40 60 a i shdn shutdown current (i gnd ) v en 0.4 v, 2.7 v v in 6.5 v 0.15 1 a i fb feedback pin current ? 0.5 0.5 a psrr power-supply rejection ratio v in = 3.85 v, v out = 2.85 v, c nr = 0.01 f, i out = 100 ma f = 100 hz 70 db f = 1 khz 66 f = 10 khz 51 f = 100 khz 38 v n output noise voltage bw = 10 hz to 100 khz, v out = 2.85 v c nr = 0.01 f 10.5 v out v rms c nr = none 94 v out start-up time v out = 2.85 v, r l = 14 ? , c out = 2.2 f c nr = 0.001 f 45 s c nr = 0.047 f 45 c nr = 0.01 f 50 c nr = none 50 v en(hi) enable high (enabled) 1.2 v in v v en(lo) enable low (shutdown) 0 0.4 v i en(hi) enable pin current, enabled v en = v in = 6.5 v 0.03 1 a uvlo undervoltage lockout v in rising 1.90 2.20 2.65 v uvlo hysteresis v in falling 70 mv t sd thermal shutdown temperature shutdown, temperature increasing 165 c reset, temperature decreasing 145
6 tps79901-ep sbvs330a ? september 2017 ? revised october 2017 www.ti.com product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated (1) see data sheet for absolute maximum and minimum recommended operating conditions. (2) silicon operating life design goal is 10 years at 105 c junction temperature (does not include package interconnect life). (3) enhanced plastic product disclaimer applies. figure 1. tps79901-ep derating chart continuous junction temperature t j ( q c) estimated life (hrs) 80 90 100 110 120 130 140 100 1000 10000 100000 1000000 d008 electromigration fail mode
7 tps79901-ep www.ti.com sbvs330a ? september 2017 ? revised october 2017 product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated 6.6 typical characteristics at t j = ? 55 c to +125 c, v in = v out(nom) + 0.3 v or 2.7 v, whichever is greater; i out = 1 ma, v en = v in , c out = 2.2 f, c nr = 0.01 f, and v out = 3 v (unless otherwise noted). typical values are at t j = 25 c. figure 2. load regulation figure 3. line regulation figure 4. output voltage vs junction temperature figure 5. dropout voltage vs output current figure 6. dropout voltage vs junction temperature i out = 200 ma figure 7. dropout vs input voltage i out (ma) change in v out (mv) 0 50 100 150 200 -15 -10 -5 0 d001 t j = 55 q c t j = 40 q c t j = 25 q c t j = 85 q c t j = 125 q c v in (v) change in v out (%) 2.5 3.5 4.5 5.5 6.5 7.5 -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 d002 t j = 55 q c t j = 40 q c t j = 25 q c t j = 85 q c t j = 125 q c t j ( q c) change in v out (%) -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 d003 i out = 200ma i out = 100ma i out = 1ma i out (ma) v do (mv) 0 50 100 150 200 0 20 40 60 80 100 120 140 d004 tj = 55 q c tj = 40 q c tj = 25 q c tj = 85 q c tj = 125 q c t j ( q c) v od (mv) -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 -20 0 20 40 60 80 100 120 140 160 180 200 d005 i out = 200ma i out = 100ma i out = 1ma 110 100 90 80 70 60 50 40 30 20 10 0 v do (mv) 2.5 3.0 3.5 4.0 5.0 6.0 7.0 4.5 5.5 6.5 v in (v)
8 tps79901-ep sbvs330a ? september 2017 ? revised october 2017 www.ti.com product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated typical characteristics (continued) at t j = ? 55 c to +125 c, v in = v out(nom) + 0.3 v or 2.7 v, whichever is greater; i out = 1 ma, v en = v in , c out = 2.2 f, c nr = 0.01 f, and v out = 3 v (unless otherwise noted). typical values are at t j = 25 c. v out = 2.85 v figure 8. ground pin current vs input voltage figure 9. ground pin current vs junction temperature figure 10. ground pin current (disabled) vs junction temperature v in ? v out = 1 v v out = 2.85 v c nr = 0.01 f c out = 2.2 f figure 11. power-supply ripple rejection vs frequency v in ? v out = 0.5 v v out = 2.85 v c nr = 0.01 f c out = 2.2 f figure 12. power-supply ripple rejection vs frequency v in ? v out = 0.25 v v out = 2.85 v c nr = 0.01 f c out = 2.2 f figure 13. power-supply ripple rejection vs frequency 90 80 70 60 50 40 30 20 10 0 10 100 1k 10k frequency (hz) psrr (db) 100k 1m 10m i out = 100ma i out = 1ma i out = 200ma 90 80 70 60 50 40 30 20 10 0 10 100 1k 10k frequency (hz) psrr (db) 100k 1m 10m i out = 1ma i out = 100ma i out = 200ma t j ( q c) i gnd ( p a) -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 0 10 20 30 40 50 60 d006 v in = 2.7 v v in = 3.2 v v in = 5 v 6050 40 30 20 10 0 i ( a) gnd m 2.5 3.0 4.5 5.5 6.5 v (v) in 7.0 3.5 4.0 5.0 6.0 i = 200 ma out i = 500 a out m 90 80 70 60 50 40 30 20 10 0 10 100 1k 10k frequency (hz) psrr (db) 100k 1m 10m i out = 200ma i out = 100ma i out = 1ma tj ( q c) i gnd (na) -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 0 100 200 300 400 500 600 d007 v in = 3.2 v v in = 6.5 v
9 tps79901-ep www.ti.com sbvs330a ? september 2017 ? revised october 2017 product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated typical characteristics (continued) at t j = ? 55 c to +125 c, v in = v out(nom) + 0.3 v or 2.7 v, whichever is greater; i out = 1 ma, v en = v in , c out = 2.2 f, c nr = 0.01 f, and v out = 3 v (unless otherwise noted). typical values are at t j = 25 c. v in ? v out = 1 v v out = 2.85 v c nr = 0.01 f c out = 10 f figure 14. power-supply ripple rejection vs frequency v in ? v out = 0.25 v v out = 2.85 v c nr = 0.01 f c out = 10 f figure 15. power-supply ripple rejection vs frequency v in ? v out = 1 v v out = 2.85 v c out = 10 f figure 16. power-supply ripple rejection vs frequency i out = 1 ma c nr = 0.01 f c out = 2.2 f figure 17. power-supply ripple rejection vs v in ? v out i out = 100 ma c nr = 0.01 f c out = 2.2 f figure 18. power-supply ripple rejection vs v in ? v out i out = 200 ma c nr = 0.01 f c out = 2.2 f figure 19. power-supply ripple rejection vs v in ? v out 90 80 70 60 50 40 30 20 10 0 psrr (db) 0.0 1.0 1.5 0.5 2.0 2.5 v in - v out (v) 3.0 3.5 4.0 0.1khz 10khz 1khz 100khz 1mhz 90 80 70 60 50 40 30 20 10 0 0.0 1.0 1.5 0.5 2.0 2.5 v in - v out (v) psrr (db) 3.0 3.5 4.0 0.1khz 1khz 10khz 100khz 1mhz 90 80 70 60 50 40 30 20 10 0 0.0 1.0 1.5 0.5 2.0 2.5 v in - v out (v) psrr (db) 3.0 3.5 4.0 0.1khz 100khz 1khz 10khz 1mhz 90 80 70 60 50 40 30 20 10 0 10 100 1k 10k frequency (hz) psrr (db) 100k 1m 10m i out = 1ma i out = 200ma 90 80 70 60 50 40 30 20 10 0 10 100 1k 10k frequency (hz) psrr (db) 100k 1m 10m i out = 200ma i out = 1ma 90 80 70 60 50 40 30 20 10 0 10 100 1k 10k frequency (hz) psrr (db) 100k 1m 10m i out = 1ma i out = 200ma
10 tps79901-ep sbvs330a ? september 2017 ? revised october 2017 www.ti.com product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated typical characteristics (continued) at t j = ? 55 c to +125 c, v in = v out(nom) + 0.3 v or 2.7 v, whichever is greater; i out = 1 ma, v en = v in , c out = 2.2 f, c nr = 0.01 f, and v out = 3 v (unless otherwise noted). typical values are at t j = 25 c. v out = 2.85 v i out = 1 ma c out = 2.2 f figure 20. total noise vs c nr v out = 2.85 v i out = 1 ma c nr = 0.01 f figure 21. total noise vs c out v out = 2.85 v i out = 150 ma figure 22. line transient response v in = 3.35 v v out = 2.85 v figure 23. load transient response v en = v in v out = 2.85 v figure 24. turn-on response v in = 3.85 v v out = 2.85 v figure 25. enable response 10 s/div m 1v/div4v/div v out v in 0v 3.85v r w load = 19 c = 10 f out m r w load = 19 c = 2.2 f out m 10 s/div m 1v/div5v/div v out v en r = 19 load w c = 2.2 f out m r = 19 load w c = 10 f out m 20 m s/div 20mv/div 20mv/div 1v/div v out v out v in dv in dt = 1v/ m s c out = 10 m f c out = 2.2 m f 3.15v 4.15v 20 s/div m 100mv/div100mv/div 100ma/div v out v out i out c = 2.2 f out m c = 10 f out m 150ma 1ma 200 180 160 140 120 100 80 60 40 20 0 0.01 0.1 1 c nr (nf) 10 total noise ( m vrms) 35 30 25 20 15 10 50 0 5 10 15 20 c out ( m f) total noise ( m vrms) 25
11 tps79901-ep www.ti.com sbvs330a ? september 2017 ? revised october 2017 product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated typical characteristics (continued) at t j = ? 55 c to +125 c, v in = v out(nom) + 0.3 v or 2.7 v, whichever is greater; i out = 1 ma, v en = v in , c out = 2.2 f, c nr = 0.01 f, and v out = 3 v (unless otherwise noted). typical values are at t j = 25 c. v out = 2.85 v r l = 19 figure 26. power-up and power-down 50ms/div volts 76 5 4 3 2 1 0 - 1 v in v out
12 tps79901-ep sbvs330a ? september 2017 ? revised october 2017 www.ti.com product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated 7 detailed description 7.1 overview the tps79901 low-dropout (ldo) regulator combines the high performance required of many rf and precision analog applications with ultra-low-current consumption. high psrr is provided by a high-gain, high-bandwidth error loop with good supply rejection at very low headroom (v in ? v out ). a noise-reduction pin is provided to bypass noise generated by the band-gap reference and to improve psrr, while a quick-start circuit quickly charges this capacitor at start-up. the combination of high performance and low ground current also make these devices an excellent choice for portable applications. all versions have thermal and overcurrent protection, and are fully specified from ? 55 c to +125 c. the tps79901 also features inrush current protection with an en toggle start-up, and overshoot detection at the output. when the en toggle is used to start the device, current limit protection is immediately activated, restricting the inrush current to the device. if voltage at the output overshoots 5% from the nominal value, a pulldown resistor reduces the voltage to normal operating conditions, as shown in the functional block diagram . 7.2 functional block diagram figure 27. adjustable-voltage versions 7.3 feature description 7.3.1 internal current limit the tps79901 internal current limit helps protect the regulator during fault conditions. in current limit mode, the output sources a fixed amount of current that is largely independent of the output voltage. for reliable operation, do not operate the device in a current-limit state for extended periods of time. the pmos pass element in the tps79901 has a built-in body diode that conducts current when the voltage at out exceeds the voltage at in. this current is not limited; therefore, if extended reverse voltage operation is anticipated, external limiting may be required. 7.3.2 shutdown the enable pin (en) is active high and is compatible with standard and low-voltage ttl-cmos levels. when shutdown capability is not required, en can be connected to in. thermal shutdown uvlo current limit 3.3m w overshoot detect 500k 1.193v bandgap in en fb out gnd 400 w copyright ? 2017, texas instruments incorporated
13 tps79901-ep www.ti.com sbvs330a ? september 2017 ? revised october 2017 product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated feature description (continued) 7.3.3 start up the tps79901 uses a start-up circuit to quickly charge the noise reduction capacitor, c nr , if present (see the functional block diagram ). this circuit allows for the combination of very low output noise and fast start-up times. the nr pin is high impedance so a low leakage c nr capacitor must be used; most ceramic capacitors are appropriate for this configuration. note that for fastest start-up, apply v in first, and then drive the enable pin (en) high. if en is tied to in, start-up is somewhat slower. the start-up switch is closed for approximately 135 s. to ensure that c nr is fully charged during start-up, use a 0.01- f or smaller capacitor. 7.3.4 undervoltage lockout (uvlo) the tps79901 use an undervoltage lockout circuit to keep the output shut off until internal circuitry is operating properly. the uvlo circuit has a deglitch feature so that undershoot transients are typically ignored on the input if these transients are less than 50 s in duration. 7.4 device functional modes driving en over 1.2-v turns on the regulator. driving en below 0.4 v puts the regulator into shutdown mode, thus reducing the operating current to 150 na, nominal.
14 tps79901-ep sbvs330a ? september 2017 ? revised october 2017 www.ti.com product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated 8 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 8.1 application information the tps79901 ldo regulator provides high psrr while maintaining ultra-low-current consumption. the device also features inrush current protection and overshoot detection at the output. 8.2 typical applications figure 28 shows the basic circuit connections. figure 28. typical application circuit for adjustable voltage version 8.2.1 design requirements select the desired device based on the output voltage. provide an input supply with adequate headroom to account for dropout and output current to account for the gnd terminal current, and power the load. tps79901 gnd en fb in out v in v out r 1 c fb r 2 optional input capacitor. may improve source impedance, noise, or psrr. v = out 1.193 (r + r ) 1 2 r 2 v en 2.2 f m ceramic copyright ? 2017, texas instruments incorporated
15 tps79901-ep www.ti.com sbvs330a ? september 2017 ? revised october 2017 product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated typical applications (continued) 8.2.2 detailed design procedure 8.2.2.1 input and output capacitor requirements although an input capacitor is not required for stability, good analog design practice is to connect a 0.1- f to 1- f low esr capacitor across the input supply near the regulator. this capacitor counteracts reactive input sources and improves transient response, noise rejection, and ripple rejection. a higher-value capacitor may be necessary if large, fast rise-time load transients are anticipated, or if the device is located several inches from the power source. if source impedance is not sufficiently low, a 0.1- f input capacitor may be necessary to ensure stability. the tps79901 is designed to be stable with standard ceramic capacitors with values of 2.2 f or greater. x5r- and x7r-type capacitors are best because they have minimal variation in value and esr over temperature. maximum esr must be less than 1 ? . 8.2.2.2 output noise in most ldos, the band gap is the dominant noise source. if a noise-reduction capacitor (c nr ) is used with the tps79901, the band gap does not contribute significantly to noise. instead, noise is dominated by the output resistor divider and the error amplifier input. to minimize noise in a given application, use a 0.01- f noise reduction capacitor. to further optimize noise, equivalent series resistance of the output capacitor can be set to approximately 0.2 ? . this configuration maximizes phase margin in the control loop, reducing total output noise by up to 10%. noise can be referred to the feedback point; with c nr = 0.01 f total noise is approximately given by equation 1 : (1) 8.2.2.3 dropout voltage the tps79901 uses a pmos pass transistor to achieve a low-dropout voltage. when (v in ? v out ) is less than the dropout voltage (v do ), the pmos pass device is in its linear region of operation and r ds(on) of the pmos pass element is the input-to-output resistance. because the pmos device behaves like a resistor in dropout, v do approximately scales with the output current. as with any linear regulator, psrr degrades as (v in ? v out ) approaches dropout. this effect is illustrated in figure 11 through figure 19 in the typical characteristics section. 8.2.2.4 transient response as with any regulator, increasing the size of the output capacitor reduces over- and undershoot magnitude, but increases the duration of the transient response. the transient response of the tps799 is enhanced by an active pulldown device that engages when the output overshoots by approximately 5% or more when the device is enabled. when enabled, the pulldown device behaves like a 350- ? resistor to ground. 8.2.2.5 minimum load the tps79901 is stable with no output load. to meet the specified accuracy, a minimum load of 500 a is required. with loads less than 500 a at junction temperatures near 125 c, the output can drift up enough to cause the output pulldown device to turn on. the output pulldown device limits voltage drift to 5% typically; however, ground current can increase by approximately 50 a. in typical applications, the junction cannot reach high temperatures at light loads because there is no noticeable dissipated power. the specified ground current is then valid at no load in most applications. 8.2.2.6 feedback capacitor requirements the feedback capacitor, c fb , shown in figure 28 is required for stability. for a parallel combination of r 1 and r 2 equal to 250 k ? , any value from 3 pf to 1 nf can be used. values below 5 pf should be used to ensure fast startup; values above 47 pf can be used to implement an output voltage soft-start. larger value capacitors also improve noise slightly. the tps79901 is stable in unity-gain configuration (out tied to fb) without c fb . v = x v n out 10.5 v m rms v
16 tps79901-ep sbvs330a ? september 2017 ? revised october 2017 www.ti.com product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated typical applications (continued) 8.2.3 application curve c out = 2.2 f c nr = 0.01 f figure 29. power-supply rejection ratio vs frequency 8.3 do ' s and don ' ts do place at least one 2.2- f ceramic capacitor as close as possible to the out pin of the regulator. do not place the output capacitor more than 10 mm away from the regulator. do connect a 0.1- f to 1- f low equivalent series resistance (esr) capacitor across the in pin and gnd input of the regulator. do not exceed the absolute maximum ratings. 9 power supply recommendations these devices are designed to operate from an input voltage supply range between 2.7 v and 6.5 v. the input voltage range provides adequate headroom in order for the device to have a regulated output. this input supply is well-regulated and stable. if the input supply is noisy, additional input capacitors with low esr can help improve the output noise performance. 10 layout 10.1 layout guidelines 10.1.1 board layout recommendations to improve psrr and noise performance to improve ac performance (such as psrr, output noise, and transient response), design the board with separate ground planes for v in and v out , with each ground plane connected only at the gnd pin of the device. in addition, connect the bypass capacitor directly to the gnd pin of the device. 10.1.2 thermal information 10.1.2.1 thermal protection thermal protection disables the output when the junction temperature rises to approximately 165 c, allowing the device to cool. when the junction temperature cools to approximately 145 c the output circuitry is again enabled. depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. this cycling limits the dissipation of the regulator, protecting it from damage resulting from overheating. 0 10 20 30 40 50 60 70 80 90 100 10 100 1k 10k 100k 1m 10m frequency (hz) psrr (db) i out = 1 ma i out = 100 ma i out = 250 ma g001
17 tps79901-ep www.ti.com sbvs330a ? september 2017 ? revised october 2017 product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated layout guidelines (continued) any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. for reliable operation, limit junction temperature to 125 c maximum. to estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. for good reliability, thermal protection triggers at least 35 c above the maximum expected ambient condition of a particular application. this configuration produces a worst-case junction temperature of 125 c at the highest expected ambient temperature and worst-case load. the internal protection circuitry of the tps799 is designed to protect against overload conditions. this circuitry is not intended to replace proper heatsinking. continuously running the device into thermal shutdown degrades device reliability. 10.1.2.2 power dissipation the ability to remove heat from the die is different for each package type, presenting different considerations in the pcb layout. the pcb area around the device that is free of other components moves the head from the device to the ambient air. performance data for jedec low- and high-k boards are given in the thermal information table near the front of this data sheet. using heavier copper increases the effectiveness in removing heat from the device. the addition of plated through-holes to heat-dissipating layers also improves heatsink effectiveness. power dissipation depends on input voltage and load conditions. power dissipation is equal to the product of the output current times the voltage drop across the output pass element, as shown in equation 2 : (2) 10.1.2.3 package mounting solder pad footprint recommendations for the tps799 are available from the ti's website at www.ti.com . 10.2 layout example figure 30. layout example p d v in v out i out c in c out c nr gnd v i v o tps799 represents via used for application specific connections. en
18 tps79901-ep sbvs330a ? september 2017 ? revised october 2017 www.ti.com product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated 11 device and documentation support 11.1 device support 11.1.1 development support 11.1.1.1 evaluation modules an evaluation module (evm) is available to assist in the initial circuit performance evaluation using the tps799. this evm, the tps799 evaluation module, can be requested at the texas instruments web site through the product folders or purchased directly from the ti estore . 11.1.1.2 spice models computer simulation of circuit performance using spice is often useful when analyzing the performance of analog circuits and systems. a spice model for the tps799 is available through the product folders under simulation models. 11.2 documentation support 11.2.1 related documentation for related documentation, see the following: ? application report: using new thermal metrics , sbva025 . ? application report: ic package thermal metrics , spra953 ? tps799xxevm-105 user's guide , slvu130 11.3 receiving notification of documentation updates to receive notification of documentation updates, navigate to the device product folder on ti.com. in the upper right corner, click on alert me to register and receive a weekly digest of any product information that has changed. for change details, review the revision history included in any revised document. 11.4 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support.
19 tps79901-ep www.ti.com sbvs330a ? september 2017 ? revised october 2017 product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated 11.5 trademarks e2e is a trademark of texas instruments. bluetooth is a registered trademark of bluetooth sig, inc. all other trademarks are the property of their respective owners. 11.6 electrostatic discharge caution this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.7 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions.
20 tps79901-ep sbvs330a ? september 2017 ? revised october 2017 www.ti.com product folder links: tps79901-ep submit documentation feedback copyright ? 2017, texas instruments incorporated 12 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation.
package option addendum www.ti.com 11-apr-2018 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples tps79901mdrvtep active wson drv 6 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -55 to 125 17l v62/17614-01xe active wson drv 6 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -55 to 125 17l (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
package option addendum www.ti.com 11-apr-2018 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant tps79901mdrvtep wson drv 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 q2 package materials information www.ti.com 6-feb-2018 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) tps79901mdrvtep wson drv 6 250 203.0 203.0 35.0 package materials information www.ti.com 6-feb-2018 pack materials-page 2
generic package view images above are just a representation of the package family, actual package may vary. refer to the product data sheet for package details. drv 6 wson - 0.8 mm max height plastic small outline - no lead 4206925/f
www.ti.com package outline c 6x 0.35 0.25 1.6 0.1 6x 0.3 0.2 2x 1.3 1 0.1 4x 0.65 0.8 0.7 0.05 0.00 b 2.1 1.9 a 2.1 1.9 (0.2) typ wson - 0.8 mm max height drv0006a plastic small outline - no lead 4222173/b 04/2018 pin 1 index area seating plane 0.08 c 1 3 4 6 (optional) pin 1 id 0.1 c a b 0.05 c thermal pad exposed 7 notes: 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. the package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. scale 5.500
www.ti.com example board layout 0.07 min all around 0.07 max all around (1) 4x (0.65) (1.95) 6x (0.3) 6x (0.45) (1.6) (r0.05) typ ( 0.2) via typ (1.1) wson - 0.8 mm max height drv0006a plastic small outline - no lead 4222173/b 04/2018 symm 1 3 4 6 symm land pattern example scale:25x 7 notes: (continued) 4. this package is designed to be soldered to a thermal pad on the board. for more information, see texas instruments literature number slua271 (www.ti.com/lit/slua271). 5. vias are optional depending on application, refer to device data sheet. if some or all are implemented, recommended via locations are shown. solder mask opening solder mask metal under solder mask defined metal solder mask opening solder mask details non solder mask defined (preferred)
www.ti.com example stencil design 6x (0.3) 6x (0.45) 4x (0.65) (0.7) (1) (1.95) (r0.05) typ (0.45) wson - 0.8 mm max height drv0006a plastic small outline - no lead 4222173/b 04/2018 notes: (continued) 6. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. ipc-7525 may have alternate design recommendations. solder paste example based on 0.125 mm thick stencil exposed pad #7 88% printed solder coverage by area under package scale:30x symm 1 3 4 6 symm metal 7
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